Strain Gage and FEA
Following our philosophy of offering the best solutions for the problems or needs of our customers, we develop alternatives to make the Result with a more Systemic look through the work of Extensometry.
Following the standards of IPC-JEDEC 9704, Intel or more experienced customer, during the test processes, milling and other assemblies, due to the mechanical stresses on the plate, they are subject to various types of stress, such as pressure, tension, force of the needles, fingers, switch probes and even the operators themselves, which can cause failures or fatigue in BGA - Ball Grid Array, among other more sensitive components (Ex.: capacitors).
Through the use of the Strain Gage technique, ETS seeks not only to guarantee the best ICT, MDA and/or FCT test for your board, but also to guarantee the integrity of components, tracks, even the stability and guarantee of the test without causing mechanical damage to the board.
ETS is the pioneer in Strain Gage analysis for test devices in Brazil since 2005 with the largest market experience. This type of analysis is mainly recommended for boards with BGA technology.
We have one of the biggest Strain Gage specialists in Brazil, André Luis Barbosa, and a specialized team with more than 500 Strain Gage instrumentation and measurements, German HBM equipment (extensometer market reference), measurement reporting and possible consultancy process improvements after measurements.
Note: Be careful not to buy this just as a standard as everything needs to be validated, certified and understood
Technical Characteristics
German HBM Strain Gage Measuring Equipment .
“Rosette” and axial triaxial sensors.
Instrumentation and validation in various applications: ICT Test, MDA, Functional, Router , Mechanical process assemblies.
ETS Differentials
Specialized and focused team with over 15 years of experience,
Qualified equipment and based on technical standards.
Reports adhering to Intel and IPC Jedec 9704 guidelines.
Experience of 500 measurements in different platforms and processes.
Systemic vision, highly specialized team and not just a standard to be met
FEA
ETS can analyze the potential stress of the board prior to manufacturing the test device, using software that will analyze the potential stress points of your board. This analysis software is essential to analyze the X device design board: FEA - Finite Element Analysis.
The graphs show the maximum and minimum scales, according to the results obtained.
The analysis is based on the IPC/Jedec 9704 standard
